Description
IC MODEM 3.3V V.22BIS 32-TQFP Series: - Data Format: V.21, V.22, V.23, Bell 103, Bell 212A Baud Rates: 300 ~ 9.6k Voltage - Supply: 2.7 V ~ 3.6 V Mounting Type: Surface Mount Package / Case: 32-TQFP Supplier Device Package: 32-TQFP
Part Number | 73M2901CE-IGVR/F |
Main Category | Integrated Circuits (ICs) |
Sub Category | Interface - Modems - ICs and Modules |
Brand | TDK |
Description | IC MODEM 3.3V V.22BIS 32-TQFP |
Series | - |
Packaging | Tape & Reel (TR) |
Data Format | V.21, V.22, V.23, Bell 103, Bell 212A |
Baud Rates | 300 ~ 9.6k |
Voltage - Supply | 2.7 V ~ 3.6 V |
Mounting Type | Surface Mount |
Package / Case | 32-TQFP |
Supplier Device Package | 32-TQFP (7x7) |
Image |
73M2901CE-IGVR/F
TDK-EPCOS
4300
0.4
HK HEQING ELECTRONICS LIMITED
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8007
1.32
ENSPIRE TECHNOLOGY (HONG KONG) CO., LIMITED
73M2901CE-IGVR/F
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3292
2.24
Agreat Technology (Hong Kong) Co., Limited
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3.16
Xinnlinx Electronics Pte Ltd
73M2901CE-IGVR/F
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